Technology Update: Rotational BCP facility at RI

We now have a rotational buffered chemical polishing (BCP) facility at RI.

Such a setup is required to remove a layer (ca. 150 µm) from the inner surface of a superconducting RF cavity and subsequently polish this surface, so that it can be used for high-field applications. Rotational BCP helps to ensure a uniform removal of material along the surface of cavities especially of complex shape. It also avoids the creation of defects on the inner surface, which can be caused by gas bubbles sticking to the wall during a stationary BCP process.

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